Due to the increasing of demands in electronic small-sized devices the using of high effective components in electric circuits represent a great interest for engineers. Among world leaders in the field of SMT components producing one can mention TDK.At present day the company produces a wide range of SMT chip-inductors characterising
with high values of Q factor and nominal inductance, low values of resistance and high frequency losses, invcreased monolythic structure and also a wide range of working temperatures (-55° С до +125 °С).
Multilayer chip inductors are manufactured using thin sheets made of ferrite or special ceramics on which coil patterns are printed with metallic paste (normally silver). By arranging these sheets in multiple layers, a spiral-shaped internal electrode pattern is created. The multilayer technique creates the coil in a three-dimensional space without the need to wind wire on a core, which facilitates miniaturization and mass production. This revolutionary technique was developed by TDK and presented to the world for the first time in 1980. When a current flows through the coil, a magnetic flux is created. The intensity of the flux (i.e. the number of magnetic field lines) is called the inductance (L).The inductance increases proportionally to the number of coil windings squared and proportionally to the cross section area. Using a material with high magnetic permeability such as ferrite as a core results in higher inductance. This is because the higher magnetic permeability of a core has the effect of concentrating the magnetic field lines.
SMT chip-inductors with ferrite core (series NLC, NLV, NLCV, NL, NLFV) also represent a great interest. Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for Highfrequency.
The main fields of application of TDK chip-inductors:
- Smart phones
- Tablet terminals
- W-LAN
- High frequency modules
- UWB
- Bluetooth
- High frequency circuits for the mobile communication industry
- Tuners
LEPCOS is an official TDK-EPC distributor and supports in-stock a wide nomenclature of TDK-EPC standard inductors and chokes. To check the prices and positions in-stock, to make online order: SMT chip-inductors.
Main series and sizetypes of TDK chip-inductors
| Inside sight | Features | Inductance | Nominal current | Size | Ordering code | Documentation |
| Multilayer Ceramic inductors | ||||||
 |
Standard type | 0,3...180 nH | 0,05...0,6 mА | 0603 [0201 EIA] |
MLG0603S | PDF:146KB |
| 0,3...390 nH | 0,05...1А | 1005 [0402 EIA] |
MLG1005S | |||
| 1...1,000 nH | 0,07...0,6А | 1608 [0603 EIA] |
MLG1608 | |||
| Decreased sizes | 0,2...33 nH | 0,12...0,35А | 0402 [01005 EIA] |
MLG0402Q | PDF:104KB | |
| Hugh Q factor | 0,6...120 nH | 0,08...1А | 0603 [0201 EIA] |
MLG0603P | PDF:77KB | |
 |
The highest value of Q factor | 0,2...33 nH | 0,13...0.32А | 0603 [01005 EIA] |
MHQ0402P | PDF:153KB |
| 0,6...39 nH | 0,16...1А | 0603 [0201 EIA] |
MHQ0603P | |||
| 0,7...150 nH | 0,4...1,2А | 1005 [0402 EIA] |
MHQ1005P | |||
| |
High value of SRF | 1...33 nH | 0,1...0,3А | 0603 [0201 EIA] |
MLK0603 | PDF:103KB |
| 1...330 nH | 0,07...0,5А | 1005 [0402 EIA] |
MLK1005 | |||
 |
Магнитное экранирование для высокой плотности монтажа | 0,1...2.2 мкГн | 0,015...0.18А | 1005 [0402 EIA] |
MLF1005 | PDF:308KB |
| 0,047...33µH | 0,002...0,2А | 1608 [0603 EIA] |
MLF1608 | |||
| 0,047...100µH | 0,003...0,2А | 2012 [0805 EIA] |
MLF2012 | |||
 |
The best matching of AC current characteristics | 0,47...2.2 µH | 0,06...0.12 А | 1005 [0402 EIA] |
MLZ1005 | PDF:313KB |
| 0,1...22 µH | 0,055...0,7 А | 1608 [0603 EIA] |
MLZ1608 | |||
| 1...100 µH | 0,03...1 А | 2012 [0805 EIA] |
MLZ2012 | |||
 |
High thermal stability | 0.01...100 µH | 0,06...0,53А | 25 [1008 EIA] |
NLV25 | PDF:176KB |
| 0,01...470µH | 0,025...0,45А | 32 [1210 EIA] |
NLV32 | |||
| |
1...1000 µH | 0,03...0,45 А | 4532 [1812 inches] |
NL453232 | PDF:175KB | |
| 1200...10 000 µH | 0,025...0,075А | 5650 [2020 inches] |
NL565050 | |||
| |
High thermal stability | 1...33 µH | 0,12...0,475 А | 25 [1008 EIA] |
NLСV25 | PDF:532KB |
| 11...330µH | 0,07...1 А | 32 [1210 EIA] |
NLСV32 | |||
| 0.1...10 µH | 0,36...1.89 А | 25 [1008 EIA] |
NLСV25T-R | |||
| 0.1...10 µH | 0,6...2,85 А | 32 [1210 EIA] |
NLСV32T-R | |||
| 1...330 µH | 0,09...1,050 А | 4532 [1812 inches] |
NLC453232 | |||
| 1...1000 µH | 0,085...1,8 А | 5650 [2020 inches] |
NL565050 | |||
| |
High thermal stability | 1...100 µH | 0,04...0,455 А | 25 [1008 EIA] |
NLFV25 | PDF:316KB |
| 1...1000 µH | 0,02...0,75 А | 32 [1210 EIA] |
NLFV32 | |||
Additional information
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